lab-member-pic
 

Muneeb Zia

  • Research Engineer
  • Ph.D Alumni

 muneeb.zia@gatech.edu
 
 

Biography

  • PhD student in Electrical and Computer Engineering (2018), Georgia Tech
  • MS in Electrical and Computer Engineering (2013), Georgia Tech
  • BS in Electrical Engineering (2010), GIKI, Pakistan

Research Interests

  • Silicon Photonics
  • Low loss optical interconnects
  • Mechanically Flexible Interconnects

Thesis ZIA-DISSERTATION-2018.pdf

All Publications

  1. M. Zia, B. Chung, S. Sober, M. S. Bakir, "Flexible Multielectrode Arrays With 2-D and 3-D Contacts for In Vivo Electromyography Recording," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 2, pp. 197-202, Feb. 2020.

  2. M. Zia, B. Chung, S. J. Sober and M.S. Bakir, "Fabrication and Characterization of 3D Multi-Electrode Array on Flexible Substrate for In Vivo EMG Recording from Expiratory Muscle of Songbird," in Proc. IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, Dec. 2018.

  3. M. Zia, H. Oh, and M. S. Bakir, "Post-CMOS Fabrication Technology Enabling Simultaneous Fabrication of 3-D Solenoidal Micro-Inductors and Flexible I/Os," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 11, pp. 2039-2044, 2018.

  4.  P. Yeon, J. L. Gonzalez, M. Zia, S. Kochupurackal Rajan, G. S. May, M. S. Bakir, and M. Ghovanloo, "Microfabrication, Assembly, and Hermetic Packaging of mm-Sized Free-Floating Neural Probes," in Proc. IEEE Biomedical Circuits and Systems Conference (BioCAS), Turin, Italy, Oct. 2017.

  5.  P. K. Jo, M. Zia, J. L. Gonzalez, and M. S. Bakir, "Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems," in Proc. 67th IEEE Electronic Components and Technology Conf. (ECTC), Orlando, FL, May. 2017.

  6. X. Zhang, P. K. Jo, M. Zia, G. May, and M. S. Bakir, "Heterogeneous interconnect stitching technology with compressible microinterconnects for dense multi-die integration," IEEE Electron Device Letters, vol. 38, no. 2, pp. 255-257, Feb. 2017.

  7. Y. Zhang, T. E. Sarvey, Y. Zhang, M. Zia and M. S. Bakir, "Numerical and experimental exploration of thermal isolation in 3D systems using air gap and mechanically flexible interconnects," in IEEE International Interconnect Technology Conf. / Advanced Metallization Conf. (IITC/AMC), San Jose, CA, May. 2016.

  8. M. Zia, C. Zhang, H.S. Yang, L. Zheng and Muhannad Bakir, "Chip-to-chip interconnect integration technologies," IEICE Electron. Express, vol. 13, no. 6, pp. 1-16, Mar. 2016.

  9. M. Zia, T. Chi, J. Park, A. Su, J. L. Gonzalez, P. K. Jo, M. P. Styczynski, H. Wang, and M. S. Bakir, "A 3D integrated electronic microplate platform for lowcost repeatable biosensing applications," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6, no. 12, pp. 1827-1833, Dec. 2016.

  10.  M. Zia, T. Chi, C. Zhang, P. Thadesar, T. Hookway, J. Gonzalez, T. McDevitt, H. Wang, and M. S. Bakir, "A microfabricated electronic microplate platform for low-cost repeatable bio-sensing applications," in Proc. IEEE International Electron Devices Meeting (IEDM), Washington, DC, Dec. 2015.

  11. Y. Zhang, Y. Zhang, T. E. Sarvey, C. Zhang, M. Zia, M. S. Bakir, "Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3D ICs," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6. no. 1, pp. 31-39, Dec. 2015.

  12. . M. Zia, C. Zhang, P. Thadesar, T. Hookway, T. Chi, J. Gonzalez, T. McDevitt, H. Wang,  and M. S. Bakir, "Fabrication of and cell growth on silicon membranes with high density TSVs for bio-sensing applications," in Proc. IEEE Biomedical Circuits and Systems Conference (BioCAS), Atlanta, GA, Oct. 2015.

  13. C. Zhang, P. Thadesar, M. Zia, T. E. Sarvey, and M. S. Bakir, "Au-NiW mechanically flexible interconnects (MFIs) for rematable 3D integration," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), Cork, Ireland, Dec. 2014.

  14. H. S. Yang, C. Zhang, M. Zia, L. Zheng, M. Bakir, "Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge," in Proc. IEEE Photonics Society Optical Interconnects Conf., Coronado, CA, May 2014.