@inproceedings{zhang2014niw, title={Au-NiW mechanically flexible interconnects (MFIs) and TSV integration for 3D interconnects}, author={Zhang, Chaoqi and Thadesar, Paragkumar and Zia, Muneeb and Sarvey, Thomas and Bakir, Muhannad S}, booktitle={2014 International 3D Systems Integration Conference (3DIC)}, pages={1--4}, year={2014}, organization={IEEE} }