@article{zhang2015thermal, title={Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3-D ICs}, author={Zhang, Yue and Zhang, Yang and Sarvey, Thomas and Zhang, Chaoqi and Zia, Muneeb and Bakir, Muhannad}, journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, volume={6}, number={1}, pages={31--39}, year={2015}, publisher={IEEE} }