Bakir Named Director of the Packaging Research Center

Shengtao Yu Wins Intel Outstanding Student Paper Award at 73rd ECTC

I3DS members gathered at Souper Jenny in the Atlanta History Center. We celebrated our achievements and explored exciting research topics, fostering innovation in this iconic setting.

Bakir to Serve as Interim Director of Packaging Research Center

Dr. Bakir will be presenting an invited talk at IMAPS 2022 on: Electronic and Photonic Heterogeneous Integration and Fiber-Interconnection using Self-Aligning Stitch-Chip Technology

Ting Zheng won 3rd place Best Student Paper Award at IMS 2022. Congratulations Ting!

Our work on "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management" was featured in Tom's Hardware, July 2022

Dr. Bakir presented an invited talk on "Thermal management of advanced chip stacks: Advanced cooling and design for 2.5D/3D integration" at the 2022 IEEE Symposium on VLSI Technology and Circuits, June 2022.

Dr. Bakir presented a short course on "2.5D and 3D Polylithic Integration Technologies" at the 2022 IEEE Symposium on VLSI Technology and Circuits, June 2022.

Bridge-chip Interconnect Technologies - IEEE Electronics Packaging Society

Dr. Bakir will be presenting an invited talk on "3D Heterogeneous Integration" at the Semicon Korea, Feb. 2022.

Dr. Bakir was invited to present at the Advanced Packaging for Energy Efficient Microelectronics Workshop, hosted by the U.S. Department of Energy’s Advanced Manufacturing Office (AMO) and the U.S. Department of Commerce’s NIST, Jan. 12-13, 2022.

Dr. Bakir will be presenting an invited talk on "Silicon Integrated Microfluidic Cooling for 2.5D and 3D ICs in High-Performance Computing" at the Semicon Taiwan Heterogeneous Integration Global Summit, Dec. 2021.

Dr. Bakir was part of the Technical Leadership Panel on 2.5D and 3D Heterogeneous Integration at the DARPA ERI Summit, Oct. 2021.

Our work on "3D polylithic integration and thermal implications on BEOL RRAM performance" was covered in Chip Scale Review, July-August 2021

Dr. Bakir will be giving an invited talk titled “2.5D/3D Polylithic Integrated Circuit Technologies“ at the "Enabling New System Architectures with 2.5, 3D and Chiplet Technologies" Forum at ISSCC 2021.

Dr. Bakir presented an invited paper titled "Thermal Modeling of 3D Polylithic Integration and Implications on BEOL RRAM Performance" at IEDM 2020.

Dr. Bakir presented an invited talk titled "2.5D and 3D Polylithic Integration Technologies for Next Generation ICs: Design Considerations" at IMAPS 2020.

Dr. Bakir receives Outstanding Doctoral Thesis Advisor Award

SRC TECHCON Best in Session Award

Rajan Tapped for IEEE 3DIC Best Student Paper Honors

Li Tapped for ASCENT Review Best Poster Award

Neuroscientists Team with Engineers to Explore how the Brain Controls Movement

Zia’s IEEE T-CPMT Paper Named among Most Popular

Bakir Named IEEE Technical Achievement Award Recipient

Sarvey Selected for IEEE Best Paper Award

Abbaspour's Paper Selected for JMM Highlight

Three ECE Faculty Receive CTL Teaching Effectiveness Honor

Hanju Oh Wins IEEE ECTC Best Paper Honors

2016 SRC TECHCON Best in Session Award

2016 Outstanding Abstract Achievement Award, American Society of Hematology

2016 Best Team Award at NSF I-Corps in 2016 Winter Cohort

2016-2017 GEM Fellowship (Full Fellow)

2016 NSF I-Corps in 2016 Winter Cohort

IEEE Global Interposer Technology workshop best student paper award

Microfluidic cooled FPGA featured in IEEE Spectrum

Best TCPMT journal paper award for Advanced Packaging

Class of 1940 Course Survey Teaching Effectiveness Award

IEEE Global Interposer Technology Conference First Place Poster Award

Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Best Poster in the Thermal Track

SRC Education Alliance Intel Foundation/SRCEA Graduate Fellowship

IBM Ph.D. Fellowship award

IEEE International Interconnect Technology Conference (IITC) S. C. Sun Best Student Paper Award

IEEE Electronic Components and Technology Conference (ECTC) Outstanding Interactive Presentation Paper Award

SRC TECHCON 2013 Best in Session award

Intel Early Career Faculty Honor Program award ( Recipient: Dr. Bakir)

IEEE Electronic Components and Technology Conference (ECTC) Outstanding Interactive Presentation Paper Award

IEEE Global Interposer Technology Workshop First Place Best Student Paper Award

Intel Ph.D. Fellowship

Global Interposer Technology Conference Best Student Poster Award

SRC TECHCON Best in Session Paper Award

IMAPS/IEEE-CPMT Advanced Technology Workshop on Optoelectronic Packaging Best Student Paper Award

IETE-CDIL Award for Industry (Best Journal Paper Award from IETE)

SRC TECHCON Best in Session Paper Award

International Symposium on Microelectronics Best Paper in Session Award

International Symposium on Microelectronics Best Student Paper Award

SRC TECHCON Best in Session Paper Award

IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award

IEEE Electronic Components and Technology Conference (ECTC) Motorola Electronic Packaging Fellowship Student Paper Award

IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award

IEEE Custom Integrated Circuits Conference (CICC) Best Invited Paper Award

IEEE Electronic Components and Technology Conference (ECTC) Outstanding Paper Award

IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award

IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award

IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award

IEEE Electronic Components and Technology Conference (ECTC) Best Paper Award