Monolithic integrated circuits (ICs) have progressed at an unprecedented rate of innovation in the past 60 years. They have revolutionized every aspect of human life: communication, productivity, transportation, health, security, and manufacturing, for example. However, to meet the performance, power, and cost metrics of future electronic systems, polylithic integration has emerged as a critical enabler for the next phase of Moore’s Law. Polylithic integration enables the concatenation of heterogeneous ICs of various functionalities (digital, analog, photonic, and mm-wave) and materials in a manner that mimics monolithic-like densities, yet utilizes advanced off-chip ‘2.5D’ and ‘3D’ heterogeneous interconnects and packaging to provide flexibility in fabrication and design, improved scalability, improved performance and energy efficiency, reduced development time, and reduced cost. This new era of Moore’s Law is a game changer and will impact all applications, especially high-performance compute, machine learning, edge intelligence, autonomous vehicles, augmented/virtual reality, and healthcare.

Polylithic ICs will be enabled by radical 2.5D and 3D integration architectures that require co-design and co-invention of the thermal technologies, power delivery networks, and signaling (electrical and optical) networks to unleash the ultimate performance of silicon nanoelectronic systems. Our lab, explores the co-design, fabrication, and technology demonstration of such emerging 2.5D and 3D ICs and applies these advances to emerging new applications such as machine learning and healthcare.

 

Recent News

  • Dr. Bakir will be presenting an invited talk on "3D Heterogeneous Integration" at the Semicon Korea, Feb. 2022.
    February 2022
    Dr. Bakir will be presenting an invited talk on "3D Heterogeneous Integration" at the Semicon Korea, Feb. 2022.
  • Dr. Bakir was invited to present at the Advanced Packaging for Energy Efficient Microelectronics Workshop, hosted by the U.S. Department of Energy’s Advanced Manufacturing Office (AMO) and the U.S. Department of Commerce’s NIST, Jan. 12-13, 2022.
    January 2022
    Dr. Bakir was invited to present at the Advanced Packaging for Energy Efficient Microelectronics Workshop, hosted by the U.S. Department of Energy’s Advanced Manufacturing Office (AMO) and the U.S. Department of Commerce’s NIST, Jan. 12-13, 2022.
  • Dr. Bakir will be presenting an invited talk on "Silicon Integrated Microfluidic Cooling for 2.5D and 3D ICs in High-Performance Computing" at the Semicon Taiwan Heterogeneous Integration Global Summit, Dec. 2021.
    December 2021
    Dr. Bakir will be presenting an invited talk on "Silicon Integrated Microfluidic Cooling for 2.5D and 3D ICs in High-Performance Computing" at the Semicon Taiwan Heterogeneous Integration Global Summit, Dec. 2021.

Recent Publications

  1. T. Zheng, A. Kaul, S. Kochupurackal Rajan, and M. S. Bakir, "Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations," in B. Keser, and S. Kröhnert (Ed.), Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces (pp. 261-287) Wiley, 2021.

  2. M. -J. Li and M. S. Bakir, "3-D Integrated Chiplet Encapsulation (3-D ICE): High-Density Heterogeneous Integration Using SiO2-Reconstituted Tiers," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 12, pp. 2242-2245, Dec. 2021.

  3. J. L. Gonzalez, J. R. Brescia, T. Zheng, S. Kochupurackal Rajan and M. S. Bakir, "A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 12, pp. 2069-2076, Dec. 2021.

  4. J. L. Gonzalez, S. Kochupurackal Rajan, J. R. Brescia and M. S. Bakir, "A Substrate-Agnostic, Submicrometer PSAS-to-PSAS Self-Alignment Technology for Heterogeneous Integration," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 12, pp. 2061-2068, Dec. 2021.