Monolithic integrated circuits (ICs) have progressed at an unprecedented rate of innovation in the past 60 years. They have revolutionized every aspect of human life: communication, productivity, transportation, health, security, and manufacturing, for example. However, to meet the performance, power, and cost metrics of future electronic systems, polylithic integration has emerged as a critical enabler for the next phase of Moore’s Law. Polylithic integration enables the concatenation of heterogeneous ICs of various functionalities (digital, analog, photonic, and mm-wave) and materials in a manner that mimics monolithic-like densities, yet utilizes advanced off-chip ‘2.5D’ and ‘3D’ heterogeneous interconnects and packaging to provide flexibility in fabrication and design, improved scalability, improved performance and energy efficiency, reduced development time, and reduced cost. This new era of Moore’s Law is a game changer and will impact all applications, especially high-performance compute, machine learning, edge intelligence, autonomous vehicles, augmented/virtual reality, and healthcare.

Polylithic ICs will be enabled by radical 2.5D and 3D integration architectures that require co-design and co-invention of the thermal technologies, power delivery networks, and signaling (electrical and optical) networks to unleash the ultimate performance of silicon nanoelectronic systems. Our lab, explores the co-design, fabrication, and technology demonstration of such emerging 2.5D and 3D ICs and applies these advances to emerging new applications such as machine learning and healthcare.

 

Recent News

  • Dr. Bakir will be presenting an invited talk at IMAPS 2022 on: Electronic and Photonic Heterogeneous Integration and Fiber-Interconnection using Self-Aligning Stitch-Chip Technology
    October 2022
    Dr. Bakir will be presenting an invited talk at IMAPS 2022 on: Electronic and Photonic Heterogeneous Integration and Fiber-Interconnection using Self-Aligning Stitch-Chip Technology
  • Ting Zheng won 3rd place Best Student Paper Award at IMS 2022. Congratulations Ting!
    August 2022
    Ting Zheng won 3rd place Best Student Paper Award at IMS 2022. Congratulations Ting!
  • Our work on "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management" was featured in Tom's Hardware, July 2022
    July 2022
    Our work on "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management" was featured in Tom's Hardware, July 2022

Recent Publications

  1. T. Zheng and M. S. Bakir, "Benchmarking Frequency-Dependent Parasitics of Fine-Pitch Off-Chip I/Os for 2.5D and 3D Heterogeneous Integration," in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022 (Early Access).

  2. S. Yu, T. K. Gaylord and M. S. Bakir, "Fiber-Array-to-Chip Interconnections With Sub-Micron Placement Accuracy via Self-Aligning Chiplets," in IEEE Photonics Technology Letters, vol. 34, no. 19, pp. 1023-1025, 1 Oct. 2022.

  3. J. Lu, M. Zia, M. J. Williams, A. L. Jacob, B. Chung, S. J. Sober and M. S. Bakir, "High-performance Flexible Microelectrode Array with PEDOT:PSS Coated 3D Micro-cones for Electromyographic Recording", in 44th International Engineering in Medicine and Biology Conference, Glasgow, United Kingdom, Jul. 2022.

  4. T. Zheng and M. S. Bakir, “Fused-Silica Stitch-Chips with Compressible Microinterconnects for Embedded RF/mm-wave Chiplets”, in 2022 IEEE/MTT-S International Microwave Symposium (IMS), Denver, CO, Jun. 2022.