@ARTICLE{9562536,
  author={Gonzalez, Joe L. and Brescia, Jonathan R. and Zheng, Ting and Rajan, Sreejith Kochupurackal and Bakir, Muhannad S.},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, 
  title={A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment}, 
  year={2021},
  volume={11},
  number={12},
  pages={2069-2076},
  doi={10.1109/TCPMT.2021.3118334}}