@article{green2015review,
  title={A review of two-phase forced cooling in three-dimensional stacked electronics: technology integration},
  author={Green, Craig and Kottke, Peter and Han, Xuefei and Woodrum, Casey and Sarvey, Thomas and Asrar, Pouya and Zhang, Xuchen and Joshi, Yogendra and Fedorov, Andrei and Sitaraman, Suresh and others},
  journal={Journal of Electronic Packaging},
  volume={137},
  number={4},
  pages={040802},
  year={2015},
  publisher={American Society of Mechanical Engineers}
}