@article{zhang2014thermal,
  title={Thermal design and constraints for heterogeneous integrated chip stacks and isolation technology using air gap and thermal bridge},
  author={Zhang, Yang and Zhang, Yue and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={4},
  number={12},
  pages={1914--1924},
  year={2014},
  publisher={IEEE}
}