@INPROCEEDINGS{7507690,
author={Y. {Zhang} and T. E. {Sarvey} and Y. {Zhang} and M. {Zia} and M. S. {Bakir}},
booktitle={2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)},
title={Numerical and experimental exploration of thermal isolation in 3D systems using air gap and mechanically flexible interconnects},
year={2016},
volume={},
number={},
pages={83-85},
keywords={integrated circuit interconnections;integrated circuit modelling;isolation technology;three-dimensional integrated circuits;thermal isolation technology;air gap;mechanically flexible interconnects;MFI;heterogeneous 3-D integration;thermal modeling;two-tier testbed;low-power tier;3D systems;Temperature measurement;Temperature sensors;Three-dimensional displays;Isolation technology;Couplings;Junctions;Heating},
doi={10.1109/IITC-AMC.2016.7507690},
ISSN={2380-6338},
month={May},}