@ARTICLE{9541194,
  author={Zheng, Ting and Jo, Paul K. and Rajan, Sreejith Kochupurackal and Bakir, Muhannad S.},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, 
  title={Electrical Characterization and Benchmarking of Polylithic Integration Using Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Applications}, 
  year={2021},
  volume={11},
  number={11},
  pages={1824-1834},
  doi={10.1109/TCPMT.2021.3113886}}