@article{sarvey2019microfluidic,
  title={Microfluidic Cooling of a 14-nm 2.5-D FPGA With 3-D Printed Manifolds for High-Density Computing: Design Considerations, Fabrication, and Electrical Characterization},
  author={Sarvey, Thomas E and Kaul, Ankit and Rajan, Sreejith Kochupurackal and Dasu, Aravind and Gutala, Ravi and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={9},
  number={12},
  pages={2393--2403},
  year={2019},
  publisher={IEEE}
}