@article{zhang2017thermal,
  title={Thermal evaluation of 2.5-D integration using bridge-chip technology: Challenges and opportunities},
  author={Zhang, Yang and Sarvey, Thomas E and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={7},
  number={7},
  pages={1101--1110},
  year={2017},
  publisher={IEEE}
}