@article{zhang2016heterogeneous,
  title={Heterogeneous interconnect stitching technology with compressible microinterconnects for dense multi-die integration},
  author={Zhang, Xuchen and Jo, Paul K and Zia, Muneeb and May, Gary S and Bakir, Muhannad S},
  journal={IEEE Electron Device Letters},
  volume={38},
  number={2},
  pages={255--257},
  year={2016},
  publisher={IEEE}
}